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2PB709BRL データシートの表示(PDF) - NXP Semiconductors.

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2PB709BRL
NXP
NXP Semiconductors. NXP
2PB709BRL Datasheet PDF : 13 Pages
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NXP Semiconductors
2PB709BRL; 2PB709BSL
50 V, 200 mA PNP general-purpose transistors
Table 6. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Ptot
Tj
Tamb
Tstg
total power dissipation
junction temperature
ambient temperature
storage temperature
Tamb 25 °C
[1] -
-
55
65
Max Unit
250
mW
150
°C
+150 °C
+150 °C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
300
Ptot
(mW)
200
006aaa990
100
0
75
25
25
75
125
175
Tamb (°C)
FR4 PCB, standard footprint
Fig 1. Power derating curve
6. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Rth(j-sp)
Thermal characteristics
Parameter
Conditions
thermal resistance from junction in free air
to ambient
thermal resistance from junction
to solder point
Min Typ Max Unit
[1] -
-
500 K/W
-
-
140 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
2PB709BRL_2PB709BSL
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 June 2010
© NXP B.V. 2010. All rights reserved.
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