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AT24C08D データシートの表示(PDF) - Atmel Corporation

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AT24C08D Datasheet PDF : 28 Pages
First Prev 21 22 23 24 25 26 27 28
12.6 8U3-1 — 8-ball VFBGA
E
D
2. b
PIN 1 BALL PAD CORNER
TOP VIEW
PIN 1 BALL PAD CORNER
1
2
3
4
A1
A2
A
SIDE VIEW
d
8
7
(d1)
6
5
e
(e1)
BOTTOM VIEW
8 SOLDER BALLS
Notes:
1. This drawing is for general information only.
2. Dimension ‘b’ is measured at maximum solder ball diameter.
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
SYMBOL
A
A1
A2
b
D
E
e
e1
d
d1
COMMON DIMENSIONS
(Unit of Measure - mm)
MIN NOM MAX
0.73 0.79 0.85
0.09 0.14 0.19
0.40 0.45 0.50
0.20 0.25 0.30
1.50 BSC
2.0 BSC
0.50 BSC
0.25 REF
1.00 BSC
0.25 REF
NOTE
2
Package Drawing Contact:
packagedrawings@atmel.com
TITLE
8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch,
Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA)
GPC
6/11/13
DRAWING NO. REV.
GXU
8U3-1
F
AT24C08D [DATASHEET] 25
Atmel-8880B-SEEPROM-AT24C08D-Datasheet_042014

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