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FSFR1700US データシートの表示(PDF) - Fairchild Semiconductor

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FSFR1700US Datasheet PDF : 15 Pages
First Prev 11 12 13 14 15
Physical Dimensions
5.35
5.15
10 .70
10 .30
8.00
7.00
M AX 1.30
(5 .0 8)
1 .27
26.20
25.80
23.10
22.90
(1.7 0)
(R0.5 0)
(0 .7 0)
1 4.50
1 3.50
R0 .55
R0 .55
1 5.24
MAX 0.80
0.7 0
0.5 0
3.4 0
3.0 0
(1.2 0)
(1 1.0 0)
(0.5 0)
1 8.50
1 7.50
(7 .0 0)
1.3 0
1.1 0
0.60
0.40
3.4 8
2 .88
(R 0.5 0)
3.4 0
3.0 0
N OTES: UNL ESS O THERW IS E S P ECIFIED
A) THIS PACKAG E DO ES N OT COM PLY
TO ANY CURRENT PACKAGIN G STAN DAR D.
B) ALL DIM ENSIONS ARE IN MILLIMETERS.
C) DIMENSIO NS ARE EXCLUSIVE OF BU R RS,
MOLD FLASH, AND TIE BAR EXT RUSIONS.
S IP M O D A A0 9revA
Figure 26. 9-SIP Package
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation
FSFR-US Series • Rev.1.0.2
13
www.fairchildsemi.com

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