87C196LA データシートの表示（PDF） - Intel
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87C196LA Datasheet PDF : 21 Pages
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AUTOMOTIVE — 87C196LA
6.0 THERMAL CHARACTERISTICS
All thermal impedance data is approximate for static
air conditions at 1 watt of power dissipation. Values
will change depending on operating conditions and
the application. The Intel Packaging Handbook
(order number 240800) describes Intel’s thermal
impedance test methodology. The Components
Quality and Reliability Handbook (order number
210997) provides quality and reliability information.
Table 10. Thermal Characteristics
Package Type
θJA
θJC
AN87C196LA (52-pin PLCC) 42°C/W 15°C/W
NOTES:
1. θJA = Thermal resistance between junction
and the surrounding environment (ambient).
Measurements are taken 1 ft. away from
case in static air flow environment.
θJC = Thermal resistance between juction
and package surface (case).
2. All values of θJA and θJC may fluctuate
depending on the environment (with or with-
out airflow, and how much airflow) and
device power dissipation at temperature of
operation. Typical variations are ± 2°C/W.
3. Values listed are at a maximum power dissi-
pation of 0.50 W.
7.0 DESIGN CONSIDERATIONS
To be supplied.
8.0 DEVICE ERRATA
There are no known device errata at this time.
9.0 DATASHEET REVISION HISTORY
This datasheet is valid for devices with an “A” at the
end of the topside field process order (FPO)
number. Datasheets are changed as new device
information becomes available. Verify with your
local Intel sales office that you have the latest
version before finalizing a design or ordering
devices.
PRODUCT PREVIEW
21
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