REVISION SUMMARY
Revision A (July 1998)
Global
Made formatting and layout consistent with other data
sheets. Used updated common tables and diagrams
Revision B (January 1999)
Distinctive Characteristics
Added bullet for 20-year data retention at 125°C
Ordering Information
Optional Processing: Deleted “B = Burn-in”.
DC Characteristics—TTL/NMOS Compatible
ICC1, ICC2, ICC3: Added Note 2 “Maximum ICC specifi-
cations are tested with VCC = VCCmax”.
DC Characteristics—CMOS Compatible
ICC1, ICC2, ICC3: Added Note 2 “Maximum ICC specifi-
cations are tested with VCC = VCCmax”.
AC Characteristics
Figure 15. Data# Polling Timings (During Embedded
Algorithms): Added text to note.
Figure 16. Toggle Bit Timings (During Embedded Algo-
rithms): Added text to note.
Revision B+1 (April 12, 1999)
Product Selector Guide
The 55 ns option now has a VCC operating range of
±10%.
Revision B+2 (July 2, 1999)
Global
Added references to availability of device in Known
Good Die (KGD) form.
Revision C (November 12, 1999)
AC Characteristics—Figure 13. Program
Operations Timing and Figure 14. Chip/Sector
Erase Operations
Deleted tGHWL and changed OE# waveform to start at
high.
Physical Dimensions
Replaced figures with more detailed illustrations.
Revision D (November 29, 2000)
Added table of contents.
Ordering Information
Deleted burn-in option.
Trademarks
Copyright © 2000 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
ExpressFlash is a trademark of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
40
Am29F200B