ATF22V10B(1998) データシートの表示（PDF） - Atmel Corporation

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コンポーネント説明

メーカー

ATF22V10B
(Rev.:1998)

HighPerformance EE PLD

Atmel Corporation 

ATF22V10B

Packaging Information

24D3, 24-Lead, 0.300" Wide, Non-Windowed,

Ceramic Dual Inline Package (Cerdip)

Dimensions in Inches and (Millimeters)

MIL-STD-1835 D-9 CONFIG A

1.28(32.5)

1.24(31.5)

PIN

1

.200(5.08)

MAX

1.100(27.94) REF

.310(7.87)

.285(7.24)

.098(2.49)

MAX

.005(.127)

MIN

SEATING

PLANE

.200(5.08)

.125(3.18)

.110(2.79)

.090(2.29)

.015(.381)

.008(.203)

.065(1.65)

.045(1.14)

.060(1.52)

.015(.381)

.023(.584)

.014(.356)

.325(8.25)

.300(7.62)

0 REF

15

.400(10.2) MAX

28J, 28-Lead, Plastic J-Leaded Chip Carrier (PLCC)

Dimensions in Inches and (Millimeters)

JEDEC STANDARD MS-018 AB

.045(1.14) X 45° PIN NO. 1

IDENTIFY

.045(1.14) X 30° - 45° .012(.305)

.008(.203)

.032(.813)

.026(.660)

.050(1.27) TYP

.456(11.6)

.450(11.4)

SQ

.495(12.6)

.485(12.3)SQ

.300(7.62) REF SQ

.430(10.9)

.390(9.91)

SQ

.021(.533)

.013(.330)

.043(1.09)

.020(.508)

.120(3.05)

.090(2.29)

.180(4.57)

.165(4.19)

.022(.559) X 45° MAX (3X)

28L, 28-Pad, Non-Windowed, Ceramic Leadless

Chip Carrier (LCC)

Dimensions in Inches and (Millimeters)

MIL-STD-1835 C-4

24P3, 24-Lead, 0.300" Wide, Plastic Dual Inline

Package (PDIP)

Dimensions in Inches and (Millimeters)

JEDEC STANDARD MS-001 AF

1.27(32.3)

1.25(31.7)

PIN

1

.266(6.76)

.250(6.35)

.200(5.06)

MAX

1.100(27.94) REF

.090(2.29)

MAX

.005(.127)

MIN

SEATING

PLANE

.151(3.84)

.125(3.18)

.110(2.79)

.090(2.29)

.012(.305)

.008(.203)

.065(1.65)

.040(1.02)

.070(1.78)

.020(.508)

.023(.584)

.014(.356)

.325(8.26)

.300(7.62)

0 REF

15

.400(10.2) MAX

13

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