DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

AD1582A(RevM) データシートの表示(PDF) - Analog Devices

部品番号
コンポーネント説明
メーカー
AD1582A Datasheet PDF : 17 Pages
First Prev 11 12 13 14 15 16 17
Data Sheet
AD1582/AD1583/AD1584/AD1585
OUTPUT VOLTAGE HYSTERESIS
High performance industrial equipment manufacturers can
require the AD1582/AD1583/AD1584/AD1585 to maintain a
consistent output voltage error at 25°C after the references are
operated over the full temperature range. All references exhibit
a characteristic known as output voltage hysteresis; however, the
AD1582/AD1583/AD1584/AD1585 are designed to minimize
this characteristic. This phenomenon can be quantified by
measuring the change in the +25°C output voltage after
temperature excursions from +125°C to +25°C and from −40°C
to +25°C. Figure 13 displays the distribution of the
AD1582/AD1583/AD1584/AD1585 output voltage hysteresis.
80
SUPPLY CURRENT VS. TEMPERATURE
The quiescent current for the AD1582/AD1583/AD1584/
AD1585 varies slightly over temperature and input supply
range. Figure 15 illustrates the typical performance for the
AD1582/AD1583/AD1584/AD1585 reference when varying
both temperature and supply voltage. As is evident from
Figure 15, the AD1582/AD1583/AD1584/AD1585 supply
current increases only 1.0 µA/V, making this device extremely
attractive for use in applications where there can be wide
variations in supply voltage and a need to minimize power
dissipation.
100
70
80
60
60
TA = +85°C
TA = +25°C
50
40
40
30
TA = –40°C
20
20
10
0
–700
–450
–200
50
300
550
ppm
Figure 13. Output Voltage Hysteresis Distribution
SOLDER HEAT EFFECT
0
3
4
5
6
7
8
9
10
11
VIN (V)
Figure 15. Typical Supply Current over Temperature
SUPPLY VOLTAGE
The mechanical stress and heat effect of soldering a device to a
printed circuit board (PCB) can cause the output voltage of a
reference to shift in value. The materials that make up a
semiconductor device and its package have different rates of
expansion and contraction. If the stress on the die has changed
position, it can cause a shift on the output voltage after being
exposed to extreme soldering temperatures. This shift is similar
to, but more severe than, thermal hysteresis. Typical result
of soldering temperature effects on the AD1582/AD1583/
AD1584/AD1585 output values shift is shown in Figure 14.
Figure 14 shows the output shift due to soldering and does not
include mechanical stress.
60
50
40
30
One of the ideal features of the AD1582/AD1583/AD1584/AD1585
is low supply voltage headroom. The parts can operate at supply
voltages as low as 200 mV above VOUT and up to 12 V. However,
if negative voltage is inadvertently applied to VIN with respect to
ground, or any negative transient >5 V is coupled to VIN, the
device can be damaged.
AC PERFORMANCE
To apply the AD1582/AD1583/AD1584/AD1585, it is impor-
tant to understand the effects of dynamic output impedance
and power supply rejection. In Figure 16, a voltage divider
is formed by the AD1582/AD1583/AD1584/ AD1585 output
impedance and by the external source impedance. Figure 17
shows the effect of varying the load capacitor on the reference
output. Power supply rejection ratio (PSRR) should be determined
when characterizing the ac performance of a series voltage
reference. Figure 18 shows a test circuit used to measure PSRR,
and Figure 19 demonstrates the ability of the AD1582/AD1583/
AD1584/AD1585 to attenuate line voltage ripple.
20
10
0
–0.20 –0.15 –0.10 –0.05
0
0.05 0.10 0.15 0.20
OUTPUT SHFT DUE TO SOLDER HEAT EFFECT (%)
VLOAD DC 5V
10k
2 × VOUT
×1
2k
10k
DUT
5µF
±2V
10k
±100µA
1µF
Figure 16. Output Impedance Test Circuit
Figure 14. Output Shift due to Solder Heat Effect
Rev. M | Page 13 of 17

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]