BSS138LT3(2004) データシートの表示（PDF） - ON Semiconductor
部品番号
コンポーネント説明
メーカー
BSS138LT3 Datasheet PDF : 6 Pages
| |||
BSS138LT1
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AH
A
L
3
BS
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
4. 318−03 AND −07 OBSOLETE, NEW STANDARD
318−08.
V
G
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.1102 0.1197 2.80 3.04
C
B 0.0472 0.0551 1.20 1.40
C 0.0350 0.0440 0.89 1.11
D
H
K
J
D 0.0150 0.0200
G 0.0701 0.0807
H 0.0005 0.0040
0.37
1.78
0.013
0.50
2.04
0.100
J 0.0034 0.0070 0.085 0.177
K 0.0140 0.0285 0.35 0.69
L 0.0350 0.0401 0.89 1.02
S 0.0830 0.1039 2.10 2.64
V 0.0177 0.0236 0.45 0.60
STYLE 21:
PIN 1. GATE
2. SOURCE
3. DRAIN
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
0.9
0.035
2.0
0.079
0.8
0.031
ǒ Ǔ SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
Share Link: 