MC13175D データシートの表示（PDF） - LANSDALE Semiconductor Inc.
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MC13175D Datasheet PDF : 16 Pages
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ML13175/ML13176
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
PLASTIC PACKAGE
(ML13175-5P, ML13176-5P)
CASE 751B
(SO–16)
–A
–
16
9
–B P 0.25 (0.010) M B M
1
–
8 PL
8
R X 45°
G
C
–T
–
D16 PL
SEATING
PLANE
K
M
F
J
0.25 (0.010) M T B S A S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. 751B–01 IS OBSOLETE, NEW STANDARD
751B–03.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G
1.27 BSC
0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabil-
ity, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the cus-
tomer’s technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
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