CMF-SDP35A-XX-2 データシートの表示（PDF） - Bourns, Inc
部品番号
コンポーネント説明
メーカー
CMF-SDP35A-XX-2 Datasheet PDF : 3 Pages
| |||
10.2
402)
MAX1. 0.2
(402)
MAX.
3
8)
CMF-SDP Series - Telecom CPTC Resettable Fuses
Solder Reflow Recommendations
300
Preheating
Soldering
250
200
150
100
50
0
160–220
10–20
Time (seconds)
Cooling
120
Solder reflow
• Recommended reflow methods: IR, vapor phase oven, hot air oven.
• Devices are not designed to be wave soldered to the bottom side of the
board.
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents.
Note:
• If reflow temperatures exceed the recommended profile, devices may not
meet the performance requirements.
Rework
• A device should not be reworked.
Product Dimensions
CMF-SDP05, 07, 10, 25, 35, 50 & 75
CMF-SDP05, 07, 10, 25, 35, 50 & 75
11.5
(.453)
MAX.11.5
(.453)
MAX.
9.0
(.354)
MAX.
2.6
(.102)
5.0
9.0
(.354)
MAX.
2.6
(.102)
(.197)
(1.413.(03.51).9M07A) X.
Recommended Pad Layout
11.0
(.433)
MAX.
9.0
(.354)
9.0
(.354)
11.0
(.433)
7.6 11.0
(.299) (.433)
5.0
7.6
(.197) (.299)
5.0
(.197)
10.0
(.394)
10.0
(.394)
3.2
(.126)
3.2
(.126)
2.6
2.0 (.102)
(.079)
2.6
2.0 (.102)
(.079)
Packaging - Tape and Reel: 350 pcs. per reel
CMF-SDP10A, 25A, 35A, 50A & 75A
CMF-SDP180.7A5 , 25A, 35A, 50A & 75A
(.344) MAX.
8.75
(.344)
MAX.
10.2
(402)
MAX1. 0.2
(402)
MAX.
MAX.
8.75
(.344M) AX.
8.75
(.344)
2.4
(.094)
3.9 2.4
(.154().094)
3.9
(.154)
0.5
(.020)
2 PLCS0..5
(.020)
2 PLCS.
3.2
8.2 (.126)
(.323)
3.2
8.2 (.126)
(.323)
7.2
(.283)
MAX.
7.2
(.283)
MAX.
7.2
(.283)
MAX.7.2
(.283)
MAX.
6.3
(.248)
3.9
(.154) 6.3
(.248)
3.9
(.154)
2.4
(.094)
2.0
(.079)
2.4
(.094)
2.0
(.079)
DIMENSIONS:
MM
(INCHES)
Packaging - Tape and Reel: 350 pcs. per reel
CMF-SDP05
CMF-SD
(.
10
(.39
CMF-SDP SERIES, REV. E, 07/16
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Share Link: 