TJA1020 データシートの表示（PDF） - NXP Semiconductors.

部品番号

コンポーネント説明

メーカー

TJA1020

LIN transceiver

NXP Semiconductors. 

Philips Semiconductors

LIN transceiver

BONDING PAD LOCATIONS

Product specification

TJA1020

handbook, full pagewidth

1

8

2

y

7

x

3

4

0

0

6

5A 5B 5C

MGW322

Fig.10 Bonding pad locations.

Table 2 Bonding pad locations (dimensions in µm). All x and y co-ordinates are referenced to the bottom left hand

corner of the top aluminium layer.

SYMBOL

RXD

NSLP

NWAKE

TXD

GND1

GND2

GND3

LIN

BAT

INH

PAD

1

2

3

4

5A

5B

5C

6

7

8

x

111

111

165

134

1 075

1 185

1 295

1 318

1 235

1 125

CO-ORDINATES

y

1 570

1 395

424

134

90

90

90

419

1 133

1 490

2004 Jan 13

16

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