SMDA03LCC-LF-T7 データシートの表示（PDF） - Protek Devices
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SMDA03LCC-LF-T7 Datasheet PDF : 5 Pages
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APPLICATION NOTE
SMDA03LC
thru
SMDA24LCC
The SMDAxxLC & SMDAxxLCC Series are TVS arrays designed to protect I/O or data lines from the damaging effects of ESD, EFT and other types
of surges. This product series provides both unidirectional and bidirectional protection, with a surge capability of 500 Watts PPP per line for an 8/20µs
waveform and ESD protection > 40kV.
UNIDIRECTIONAL COMMON-MODE CONFIGURATION(Figure 1)
The SMDAxxLC Series provides up to four (4) lines of protection in a common-mode
configuration as depicted in Figure 1.
Circuit connectivity is as follows:
✔ Line 1 is connected to Pin 5.
✔ Line 2 is connected to Pin 6.
✔ Line 3 is connected to Pin 7.
✔ Line 4 is connected to Pin 8.
✔ Pins 1-4 are connected to ground.
BIDIRECTIONAL COMMON-MODE CONFIGURATION (Figure 2)
Ideal for Ethernet applications, SMDAxxLCC Series provides up to four (4) lines of
protection in a common-mode configuration as depicted in Figure 2.
Figure 1. Unidirectional Common-Mode Protection
LINE 1
LINE 2
LINE 3
LINE 4
8
7
6
5
Circuit connectivity is as follows:
✔ TPIN is connected to Pin 5.
✔ TPIP is connected to Pin 6.
✔ TPON is connected to Pin 1.
✔ TPOP is connected to Pin 2.
✔ Pins 3, 4, 7 & 8 are connected to ground.
1
2
3
4
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
GND PLANE
Circuit board layout is critical for Electromagnetic
Compatibility (EMC) protection. The following
guidelines are recommended:
✔ The protection device should be placed near the
input terminals or connectors, the device will
divert the transient current immediately before it
can be coupled into the nearby traces.
Figure 2. Bidirectional Common-Mode Protection
TPIN
✔ The path length between the TVS device and the
TPIP
protected line should be minimized.
✔ All conductive loops including power and ground
loops should be minimized.
8
7
6
5
✔ The transient current return path to ground
should be kept as short as possible to reduce
parasitic inductance.
✔ Ground planes should be used whenever
possible. For multilayer PCBs, use ground vias.
1
2
3
4
TPON
05074.R6 4/05
TPOP
4
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