Data Sheet
PACKAGING DIAGRAMS
Pin # 1 Identifier
16 Mbit / 32 Mbit Multi-Purpose Flash Plus
SST39VF1601 / SST39VF3201
SST39VF1602 / SST39VF3202
12.20
11.80
1.05
0.95
0.50
BSC
0.27
0.17
18.50
18.30
0.15
0.05
0.70
0.50
20.20
19.80
1.20
max.
Note: 1. Complies with JEDEC publication 95 MO-142 DD dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
FIGURE 25: 48-lead Thin Small Outline Package (TSOP) 12mm x 20mm
SST Package Code: EK
DETAIL
0.70
0.50
0°- 5°
1mm
48-tsop-EK-8
©2008 Silicon Storage Technology, Inc.
30
S71223-05-000
6/08