AT24C16D-PUM データシートの表示（PDF） - Atmel Corporation

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AT24C16D-PUM

I2C-Compatible (2-Wire) Serial EEPROM 16-Kbit (2,048 x 8)

Atmel Corporation 

10. Ordering Information

Atmel Ordering Code

Lead Finish

Package

Delivery Information

Form

Quantity

Operation

Range

AT24C16D-SSHM-T

AT24C16D-SSHM-B

Tape and Reel 4,000 per Reel

8S1

Bulk (Tubes) 100 per Tube

AT24C16D-XHM-T

AT24C16D-XHM-B

Tape and Reel 5,000 per Reel

NiPdAu

8X

(Lead-free/Halogen-free)

Bulk (Tubes) 100 per Tube

AT24C16D-MAHM-T

AT24C16D-MAHM-E

AT24C16D-PUM

AT24C16D-STUM-T

Matte Tin

(Lead-free/Halogen-free)

8MA2

8P3

5TS1

Tape and Reel

Tape and Reel

Bulk (Tubes)

5,000 per Reel

15,000 per Reel

50 per Tube

Industrial

Temperature

(-40C to 85C)

Tape and Reel 5,000 per Reel

AT24C16D-CUM-T

AT24C16D-UUM0B-T(1)

SnAgCu Ball

(Lead-free/Halogen-free)

8U3-1

4U-5

Tape and Reel 5,000 per Reel

Tape and Reel 5,000 per Reel

AT24C16D-WWU11M(2)

N/A

Wafer Sale

Notes: 1. WLCSP Package:

 This device includes a backside coating to increase product robustness.

 CAUTION: Exposure to ultraviolet (UV) light can degrade the data stored in the EEPROM cells.

Therefore, customers who use a WLCSP product must ensure that exposure to ultraviolet light

does not occur.

2. For wafer sales, please contact Atmel Sales.

8S1

8X

8MA2

8P3

5TS1

8U3-1

4U-5

Package Type

8-lead, 0.15” wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP)

8-pad, 2.00mm x 3.00mm x 0.60mm body, 0.50mm Pitch, Ultra Thin Dual Flat No Lead (UDFN)

8-lead, 0.30" wide, Plastic Dual In-line Package (PDIP)

5-lead, 1.60mm body, Plastic Thin Shrink Small Outline (SOT23)

8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Very thin Fine Ball Grid Array (VFBGA)

4-ball, 2 x 2 Grid Array, 0.40mm pitch, Wafer Level Chip Scale Package (WLCSP)

AT24C16D [DATASHEET] 17

Atmel-8906C-SEEPROM-AT24C16D-Datasheet_052015

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