DPAD1 データシートの表示（PDF） - Micross Components

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DPAD1

LOW LEAKAGE PICO-AMP DUAL DIODE

Micross Components 

DPAD1

LOW LEAKAGE

PICO-AMP DUAL DIODE

Linear Systems replaces discontinued Siliconix DPAD1

The DPAD1 is a low leakage Monolithic Dual Pico-Amp Diode

The DPAD1 extremely low-leakage monolithic dual

diode provides a superior alternative to conventional

diode technology when reverse current (leakage) must

be minimized. In addition the monolithic dual

construction allows excellent capacitance matching per

diode. The DPAD1 features a leakage current of -1 pA

and is well suited for use in applications such as input

protection for operational amplifiers.

DPAD1 Benefits:

ƒ Negligible Circuit Leakage Contribution

ƒ Circuit “Transparent” Except to Shunt

High-Frequency Spikes

ƒ Simplicity of Operation

DPAD1 Applications:

ƒ Op Amp Input Protection

ƒ Multiplexer Overvoltage Protection

FEATURES

DIRECT REPLACEMENT FOR SILICONIX DPAD1

HIGH ON ISOLATION

EXCELLENT CAPACITANCE MATCHING

ULTRALOW LEAKAGE

REVERSE BREAKDOWN VOLTAGE

REVERSE CAPACITANCE

ABSOLUTE MAXIMUM RATINGS

@ 25°C (unless otherwise noted)

Maximum Temperatures

Storage Temperature

Operating Junction Temperature

Maximum Power Dissipation

Continuous Power Dissipation

MAXIMUM CURRENT

Forward Current (Note 1)

20fA

∆CR ≤ 0.2pF

≤ 1 pA

BVR ≥ ‐45V

Crss ≤ 0.8pF

‐65°C to +150°C

‐55°C to +135°C

500mW

50mA

Click To Buy DPAD1 ELECTRICALCHARACTERISTICS@ 25°C(unlessotherwisenoted)

SYMBOL

CHARACTERISTICS

MIN. TYP.

BVR

Reverse Breakdown Voltage

‐45

‐‐

MAX.

‐‐

UNITS

V

CONDITIONS

IR = ‐1µA

VF

Forward Voltage

‐‐

0.8

1.5

V

IF = 1mA

CrSS

Total Reverse Capacitance

‐‐

‐‐

0.8

pF

VR = ‐5V, f = 1MHz

|CR1‐CR2|

Differential Capacitance (∆CR)

‐‐

‐‐

0.2

pF

VR1 = VR2 = ‐5V, f = 1MHz

IR

Maximum Reverse Leakage Current ‐‐

‐‐

‐1

pA

VR = ‐ 20V

Notes:

1. Absolute maximum ratings are limiting values above which DPAD1 serviceability may be impaired.

Available Packages:

DPAD1 in TO-78

DPAD1 available as bare die

Please contact Micross for full package and die dimensions

TO-78 (Bottom View)

Micross Components Europe

Tel: +44 1603 788967

Email: chipcomponents@micross.com

Web: http://www.micross.com/distribution

Information furnished by Linear Integrated Systems and Micross Components is believed to be accurate and reliable. However, no responsibility is assumed for its use; nor for any infringement of patents or

other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Linear Integrated Systems.

Micross Components Ltd, United Kingdom, Tel: +44 1603 788967, Fax: +44 1603788920, Email: baredie@micross.com Web: www.micross.com/distribution.aspx

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