MT6260A データシートの表示（PDF） - MediaTek Inc
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MT6260A Datasheet PDF : 94 Pages
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MT6260A
GSM/GPRS/EDGE-RX SOC Processor Technical Brief
v1.1 Confidential A
2.10.2 Thermal Operating Specifications
Symbol
Description
Thermal resistance from device junction to package
case
Maximum package temperature
Maximum power dissipation
Value
48
65
1.28
Unit
C/W
Deg C
W
Notes
2.10.3 Lead-free Packaging
MT6260A is provided in a lead-free package and meets RoHS requirements
2.11 Ordering Information
2.11.1 Top Marking Definition
MEDIATEK
ARM
MT6XXXX
DDDD - ####
LLLLLL
MTXXXXXX
DDDD:
####:
LLLLLL:
Product No.
Date Code
Subcontractor Code
Die Lot No.
Figure 19. Mass production top marking of MT6260A
Part number
MT6260A/A
Package
TFBGA
Description
8.6mm*9.6mm, 199 ball 0.5 mm pitch package,
non-security versi n
MediaTek Confidential
© 2013 MediaTek Inc.
This document contains information that is proprietary to MediaTek Inc.
Unauthorized reproduction or disclosure of this informa ion in whole or in part is strictly prohibited.
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