6N137, HCNW137, HCNW2601, HCNW2611, HCPL-0600, HCPL-0601, HCPL-
0611, HCPL-0630, HCPL-0631, HCPL-0661, HCPL-2601, HCPL-2611, HCPL-
2630, HCPL-2631, HCPL-4661 Data Sheet
Absolute Maximum Ratings5
No derating required up to 85°C.
High CMR, High Speed TTL Compatible Optocouplers
Parameter
Symbol
Packagea
Min.
Max.
Units
Note
Storage Temperature
TS
–55
125
°C
Operating Temperatureb
TA
–40
85
°C
Average Forward Input Current
IF
Single 8-Pin DIP
—
Single SO-8
Widebody
20
mA
c
Dual 8-Pin DIP
—
15
d, e
Dual SO-8
Reverse Input Voltage
VR
8-Pin DIP, SO-8
—
5
Widebody
—
3
V
d
Input Power Dissipation
PI
Widebody
—
Single 8-Pin DIP
—
40
mW
36
Dual 8-Pin DIP
—
27
Supply Voltage (1 Minute Maximum)
VCC
—
7
V
Enable Input Voltage (not to exceed VCC
VE
Single 8-Pin DIP
—
by more than 500 mV)
Single SO-8
Enable Input Current
IE
Widebody
—
VCC + 0.5
V
5
mA
Output Collector Current
IO
—
50
mA
d
Output Collector Voltage
VO
—
7
V
d
Output Collector Power Dissipation
PO
Single 8-Pin DIP
—
Single SO-8
Widebody
85
mW
Dual 8-Pin DIP
—
60
d, f
Dual SO-8
Lead Solder Temperature (Through
Hole Parts Only)
TLS
8-Pin DIP
—
260°C for 10 s,
1.6 mm below
seating plane
Widebody
—
260°C for 10s, up to
seating plane
Solder Reflow Temperature Profile
(Surface Mount Parts Only)
SO-8 and Option
—
See Package Outline
300
Drawings
a. Ratings apply to all devices except otherwise noted in the Package column.
b. 0°C to 70°C on JEDEC Registration.
c. Peaking circuits may produce transient input currents up to 50 mA, 50 ns maximum pulse width, provided average current does not exceed
20 mA.
d. Each channel.
e. Peaking circuits may produce transient input currents up to 50 mA, 50 ns maximum pulse width, provided average current does not exceed
15 mA.
f. Derate linearly above 80°C free-air temperature at a rate of 2.7 mW/°C for the SOIC-8 package.
5. JEDEC Registered Data (for 6N137 only).
Broadcom
AV02-0940EN
14