24-Lead Cerdip (Q-24)
24
PIN 1
1
0.225
(5.715)
MAX
1.290 (32.77) MAX
13
0.295 (7.493)
MAX
12
0.180
(4.572)
MAX
0.320 (8.128)
0.290 (7.366)
0.125
(3.175)
MIN
0.021 (0.533)
0.015 (0.381)
TYP
0.110 (2.794)
0.090 (2.286)
TYP
SEATING
PLANE
0.070 (1.778)
0.065 (1.651) 0.020 (0.508)
15°
0.055 (1.397)
0°
TYP
1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH.
2. CERDIP LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
0.012 (0.305)
0.008 (0.203)
TYP
28-Lead SOIC (R-28)
28
PIN 1
1
15
0.299 (7.6)
0.291 (7.39)
0.414 (10.52)
14
0.398 (10.10)
0.708 (18.02)
0.696 (17.67)
0.096 (2.44)
0.089 (2.26)
0.03 (0.76)
0.02 (0.51)
0.01 (0.254)
0.006 (0.15)
0.05 (1.27)
BSC
0.019 (0.49)
0.014 (0.35)
6°
0.013 (0.32) 0°
0.009 (0.23)
0.042 (1.067)
0.018 (0.457)
1. LEAD NO. IDENTIFIED BY A DOT.
2. SOICLEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
24-Lead SOIC (R-24)
24
PIN 1
1
13
0.299 (7.6)
0.291 (7.39)
0.414 (10.52)
0.398 (10.10)
12
0.608 (15.45)
0.596 (15.13)
0.096 (2.44)
0.089 (2.26)
0.03 (0.76)
0.02 (0.51)
0.01 (0.254)
0.006 (0.15)
0.05 (1.27)
BSC
0.019 (0.49)
0.014 (0.35)
6°
0.013 (0.32) 0°
0.009 (0.23)
0.042 (1.067)
0.018 (0.447)
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS
28-Lead SSOP (RS-28)
28
PIN 1
1
15
0.212 (5.38)
0.205 (5.207)
0.311 (7.9)
0.301 (7.64)
14
0.407 (10.34)
0.397 (10.08)
0.07 (1.78)
0.066 (1.67)
0.008 (0.203)
0.002 (0.050)
0.0256 (0.65)
BSC
8°
0°
0.009 (0.229)
0.005 (0.127)
0.037 (0.94)
0.022 (0.559)
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS
–16–