Q67000-S070 データシートの表示（PDF） - Infineon Technologies
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Q67000-S070 Datasheet PDF : 8 Pages
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Thermal Characteristics
Parameter
Rev. 1.0
Characteristics
Thermal resistance, junction - soldering point
(Pin 4)
SMD version, device on PCB:
@ min. footprint
@ 6 cm2 cooling area 1)
BSP88
Symbol
Values
Unit
min. typ. max.
RthJS
RthJA
-
-
25 K/W
-
- 115
-
-
70
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
VGS=0, ID=250µA
Gate threshold voltage, VGS = VDS
ID=108µA
Zero gate voltage drain current
VDS=240V, VGS=0, Tj=25°C
VDS=240V, VGS=0, Tj=150°C
Gate-source leakage current
VGS=20V, VDS=0
Drain-source on-state resistance
VGS=2.8V, ID=0.014A
Drain-source on-state resistance
VGS=4.5V, ID=0.32A
Drain-source on-state resistance
VGS=10V, ID=0.35A
V(BR)DSS 240
-
-V
VGS(th)
0.6
1
1.4
IDSS
IGSS
µA
-
-
0.1
-
-
10
-
1
10 nA
RDS(on)
-
4.9 15 W
RDS(on)
-
4.6 7.5
RDS(on)
-
4
6
1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Page 2
2002-11-12
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