ISL62383C データシートの表示（PDF） - Renesas Electronics
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ISL62383C
Renesas Electronics
ISL62383C Datasheet PDF : 24 Pages
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ISL62381, ISL62382, ISL62383, ISL62381C, ISL62382C, ISL62383C
Thin Quad Flat No-Lead Plastic Package (TQFN)
Thin Micro Lead Frame Plastic Package (TMLFP)
2X
A
D
0.15 C A
D/2
L32.5x5A
32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220WJJD-1 ISSUE C)
MILLIMETERS
SYMBOL
MIN
NOMINAL
MAX
NOTES
6
N
INDEX 1
AREA 2
3
2X
0.15 C B
E/2
E
A
0.70
0.75
0.80
-
A1
-
-
0.05
-
A3
0.20 REF
-
b
0.18
0.25
0.30
5, 8
D
5.00 BSC
-
D2
3.30
3.45
3.55
7, 8
TOP VIEW
B
E
5.00 BSC
-
E1
5.75 BSC
9
E2
3.30
3.45
3.55
7, 8
e
0.50 BSC
-
k
0.20
-
-
-
A / / 0.10 C
C
L
0.30
0.40
0.50
8
0.08 C
N
32
2
SEATING PLANE
SIDE VIEW
A3 A1
Nd
8
3
Ne
8
3
(DATUM B)
NX b
D2
D2
2
5
0.10 M C A B
78
NX k
N
(DATUM A)
6
INDEX
AREA
3
2
1
NX L
N
8
e
(Nd-1)Xe
REF.
(Ne-1)Xe
E2
E2/2
7
REF.
8
Rev. 2 05/06
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5m-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land Pattern
Design efforts, see Intersil Technical Brief TB389.
BOTTOM VIEW
A1
NX b
5
SECTION "C-C"
FN6665 Rev 6.00
October 23, 2015
Page 24 of 24
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