TDA8034T(2010) データシートの表示（PDF） - NXP Semiconductors.

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TDA8034T
(Rev.:2010)

Smart card interface

NXP Semiconductors. 

NXP Semiconductors

TDA8034T; TDA8034AT

Smart card interface

14.4 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to

higher minimum peak temperatures (see Figure 16) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 10 and 11

Table 10. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3)

< 350

≥ 350

< 2.5

235

220

≥ 2.5

220

220

Table 11. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3)

< 350

350 to 2000

< 1.6

260

260

1.6 to 2.5

260

250

> 2.5

250

245

> 2000

260

245

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 16.

TDA8034T_TDA8034AT

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 2.0. — 12 November 2010

© NXP B.V. 2010. All rights reserved.

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