HI-303/883 データシートの表示（PDF） - Intersil
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HI-303/883 Datasheet PDF : 11 Pages
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Die Characteristics
DIE DIMENSIONS:
76 mils x 83.9 mils x 19 mils
METALLIZATION:
Type: Aluminum
Thickness: 16kÅ ±2kÅ
GLASSIVATION:
Type: Nitride
Thickness: 7kÅ ±0.7kÅ
Metallization Mask Layout
HI-303/883
DIE ATTACH:
Material: Gold/Silicon Eutectic Alloy
Temperature: Ceramic DIP - 460°C (Max)
WORST CASE CURRENT DENSITY:
3.9 x 105A/cm2 at 30mA
This device meets Glassivation Integrity Test requirement
per MIL-STD-883 Method 2021 and MIL-M-38510 para-
graph 3.5.5.4
HI-303/883
D4
D2
S2
IN2
12
11
10
9
S4 13
V+ 14
S3 2
8 V-
7 GND
3
4
5
6
D3
D1
S1
IN1
10
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