LP62S4096E-T データシートの表示（PDF） - AMIC Technology
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LP62S4096E-T Datasheet PDF : 12 Pages
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Package Information
36LD CSP (6 x 8 mm) Outline Dimensions
TOP VIEW
Ball*A1 CORNER
123456
A
B
C
D
E
F
G
H
SIDE VIEW
LP62S4096E-T Series
BOTTOM VIEW
Ball#A1 CORNER
0.10 S C
0.25 S C A B
b (36X)
654321
unit: mm
A
B
C
D
E
F
G
H
B
e
D1
A
D
0.20(4X)
C SEATING PLANE
Symbol
A
A1
A2
D
E
D1
E1
e
b
Dimensions in mm
MIN. NOM. MAX.
1.00 1.10 1.20
0.16 0.21 0.26
0.48 0.53 0.58
5.80 6.00 6.20
7.80 8.00 8.20
--- 3.75 ---
--- 5.25 ---
--- 0.75 ---
0.25 0.30 0.35
Note:
1. THE BALL DIAMETER, BALL PITCH, STAND-OFF & PACKAGE THICKNESS
ARE DIFFERENT FROM JEDEC SPEC MO192 (LOW PROFILE BGA FAMILY).
2. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS
OF THE SOLDER BALLS.
3. DIMENSION b IS MEASURED AT THE MAXIMUM.
THEERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THE EDGE OF THE
SOLDER BALL AND THE BODY EDGE.
4. BALL PAD OPENING OF SUBSTRATE IS Φ 0.25mm (SMD)
SUGGEST TO DESIGN THE PCB LAND SIZE AS Φ 0.25mm (NSMD)
(May, 2010, Version 3.3)
11
AMIC Technology, Corp.
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