GTL2003 データシートの表示（PDF） - NXP Semiconductors.
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GTL2003 Datasheet PDF : 24 Pages
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NXP Semiconductors
16. Soldering: PCB footprints
Footprint information for reflow soldering of TSSOP20 package
GTL2003
8-bit bidirectional low voltage translator
SOT360-1
Hx
Gx
P2
(0.125)
(0.125)
Hy Gy
C
D2 (4x)
P1
D1
Generic footprint pattern
Refer to the package outline drawing for actual layout
By Ay
solder land
occupied area
DIMENSIONS in mm
P1
P2
Ay
By
C
D1 D2 Gx Gy Hx Hy
0.650 0.750 7.200 4.500 1.350 0.400 0.600 6.900 5.300 7.300 7.450
Fig 14. PCB footprint for SOT360-1 (TSSOP20); reflow soldering
GTL2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 July 2012
sot360-1_fr
© NXP B.V. 2012. All rights reserved.
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