HIP4020 データシートの表示（PDF） - Renesas Electronics

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HIP4020

Half Amp Full Bridge Power Driver for Small 3V, 5V and 12V DC Motors

Renesas Electronics 

HIP4020

HIP4020

Package Outline Drawing

M20.3

20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC)

Rev 3, 2/11

20

INDEX

AREA

7.60

7.40

3

10.65

10.00

0.25 (0.10) M B M

1 23

TOP VIEW

2

13.00

12.60

2.65

2.35

SEATING PLANE

1.27

BSC

7

0.49

0.35

0.25 (0.10) M C A M B S

SIDE VIEW

0.30

MAX

0.10 (0.004)

8°

MAX

5 1.27

0.40

0.75 x 45°

0.25

DETAIL "X"

0.32

0.23

(0.60)

20

(9.40mm)

1.27 BSC

(2.00)

12 3

TYPICAL RECOMMENDED LAND PATTERN

NOTES:

1. Dimensioning and tolerancing per ASME Y14.5M-1994.

2. Dimension does not include mold flash, protrusions or gate

burrs. Mold flash, protrusion and gate burrs shall not exceed

0.15mm (0.006 inch) per side.

3. Dimension does not include interlead lash or protrusions. Interlead

flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.

4. The chamfer on the body is optional. If it is not present, a visual

index feature must be located within the crosshatched area.

5. Dimension is the length of terminal for soldering to a substrate.

6. Terminal numbers are shown for reference only.

7. The lead width as measured 0.36mm (0.14 inch) or greater above

the seating plane, shall not exceed a maximum value of 0.61mm

(0.024 inch)

8. Controlling dimension: MILLIMETER.

9. Dimensions in ( ) for reference only.

10. JEDEC reference drawing number: MS-013-AC.

FN3976 Rev 4.00

September 17, 2015

Page 10 of 10

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