ACA1206
Notes:
(1) OUTLINE DRAWING REFERENCE:
FIGURE 29, S7 PACKAGE.
(2) UNLESS SPECIFIED DIMENSIONS
ARE SYMMETRICAL ABOUT CENTER
LINES SHOWN.
(3) DIMENSIONS IN MILLIMETERS.
(4) VIAS SHOWN IN PCB METAL VIEW
ARE FOR REFERENCE ONLY.
NUMBER & SIZE OF THERMAL VIAS
REQUIRED DEPENDENT ON HEA
DISSIPATION REQUIREMENT AND THE
PC PROC SS CAPABILITY.
(5) RECOMMENDED STENCIL THICKNESS:
APPROX. 0.125 mm (5 Mils)
Figure 33: PCB Pad Layout and Solder Mask Detail
PRELIMINARY DATA SHEET
19
204201B • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • September 16, 2016