HSMC-A101-S30J1 データシートの表示（PDF） - Broadcom Corporation
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HSMC-A101-S30J1 Datasheet PDF : 17 Pages
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HSMx-A10x-xxxxx Data Sheet
Packaging Option (X8X9)
Option
J1
J4
H1
H4
J2
J5
H2
H5
L2
Test Current
20 mA
20 mA
20 mA
20 mA
10 mA
10 mA
10 mA
10 mA
2 mA
Package Type
Top Mount
Top Mount
Reverse Mount
Reverse Mount
Top Mount
Top Mount
Reverse Mount
Reverse Mount
Top Mount
Precautionary Notes
Reel Size
7 inches
13 inches
7 inches
13 inches
7 inches
13 inches
7 inches
13 inches
7 inches
Soldering
Do not perform reflow soldering more than twice.
Observe necessary precautions of handling moisture-
sensitive device as stated in the following section.
Do not apply any pressure or force on the LED during
reflow and after reflow when the LED is still hot.
Use reflow soldering to solder the LED. Use hand
soldering only for rework if unavoidable, but it must be
strictly controlled to following conditions:
– Soldering iron tip temperature = 315°C max.
– Soldering duration = 3s max.
– Number of cycles = 1 only
– Power of soldering iron = 50W max.
Do not touch the LED package body with the soldering
iron except for the soldering terminals, as it may cause
damage to the LED.
Confirm beforehand whether the functionality and
performance of the LED is affected by soldering with
hand soldering.
PLCC-2, Surface Mount LED Indicator
Figure 14: Recommended Pb-Free Reflow Soldering Profile
255 - 260 C
217 C
3 C/SEC. MAX.
200 C
150 C
3 C/SEC. MAX.
60 - 120 SEC.
10 to 30 SEC.
6 C/SEC. MAX.
100 SEC. MAX.
TIME
(Acc. to J-STD-020C)
Figure 15: Recommended Board Reflow Direction
Handling Precautions
For automated pick and place, Broadcom has tested a
nozzle size with OD 1.5 mm to work with this LED. However,
due to the possibility of variations in other parameters such
as pick and place machine maker/model, and other settings
of the machine, verify that the selected nozzle will not cause
damage to the LED.
Broadcom
AV02-0198EN
14
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