HSP061-4F4 データシートの表示（PDF） - STMicroelectronics

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HSP061-4F4

4-line ESD protection for high speed lines

STMicroelectronics 

HSP061-4F4

4-line ESD protection for high speed lines

Flip-Chip package

6 bumps

Features

 Flow-through routing to keep signal integrity

 Ultralarge bandwidth: 13 GHz

 Ultralow capacitance: 0.5 pF

 Low leakage current: 70 nA at 25 °C

 Extended operating junction temperature

range: -40 °C to 125 °C

 Small package size: 0.72 mm2

 Very thin package: 0.380 mm typical

 RoHS compliant

Complies with following standards

 IEC 61000-4-2 level 4:

– 8 kV (contact discharge)

– 15 kV (air discharge)

Applications

The HSP061-4F4 is designed to protect against

electrostatic discharge on sub micron technology

circuits driving:

 HDMI 1.3 and 1.4

 Digital Video Interface

 Display Port

 USB 3.0

 Serial ATA

Datasheet - production data

Description

The HSP061-4F4 is a 4-channel ESD array with a

rail to rail architecture designed specifically for the

protection of high speed differential lines.

The ultra-low variation of the capacitance ensures

very low influence on signal-skew.

The device is available in a Flip-Chip package

with a 300 µm pitch, which minimizes the PCB

area.

Figure 1. Pinout (bottom view)

I/O

I/O

GND

I/O

I/O

GND

Figure 2. Functional schematic (top view)

October 2013

This is information on a product in full production.

DocID022207 Rev 2

1/7

www.st.com

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