LTC1728HS5(Rev_B) データシートの表示（PDF） - Linear Technology
部品番号
コンポーネント説明
メーカー
LTC1728HS5
(Rev.:Rev_B)
(Rev.:Rev_B)
Linear Technology
LTC1728HS5 Datasheet PDF : 16 Pages
| |||
LTC1727/LTC1728
Package Description
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
8 7 65
0.52
(.0205)
REF
0.889 ± 0.127
(.035 ± .005)
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
0.254
(.010)
DETAIL “A”
0° – 6° TYP
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
GAUGE PLANE
0.18
(.007)
0.53 ± 0.152
(.021 ± .006)
DETAIL “A”
1 234
1.10
(.043)
MAX
SEATING
PLANE 0.22 – 0.38
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
(.009 – .015)
TYP
0.65
(.0256)
BSC
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.86
(.034)
REF
0.127 ± 0.076
(.005 ± .003)
MSOP (MS8) 0204
14
S8 Package
8-Lead Plastic Small Outline (Narrow 0.150)
(Reference LTC DWG # 05-08-1610)
.050 BSC
.045 ±.005
.189 – .197
(4.801 – 5.004)
NOTE 3
8
7
6
5
.245
MIN
.160 ±.005
.228 – .244
(5.791 – 6.197)
.150 – .157
(3.810 – 3.988)
NOTE 3
.030 ±.005
TYP
RECOMMENDED SOLDER PAD LAYOUT
1
2
.010
(0.254
–
–
.020
0.508)
×
45°
.008 – .010
(0.203 – 0.254)
0°– 8° TYP
.053 – .069
(1.346 – 1.752)
.016 – .050
(0.406 – 1.270)
NOTE:
1. DIMENSIONS
IN
INCHES
(MILLIMETERS)
.014 – .019
(0.355 – 0.483)
TYP
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
34
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
SO8 0303
17278fb
Share Link: