Microprocessor Supervisory Circuit
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
A
D
Q
L
e
B
S1
L1
B1
E1
E
0°-15°
C
DIM
INCHES
MIN MAX
A
–
0.200
B 0.014 0.023
B1 0.038 0.065
C 0.008 0.015
E 0.220 0.310
E1 0.290 0.320
e
0.100
L 0.125 0.200
L1 0.150
–
Q 0.015 0.070
S
–
0.098
S1 0.005
–
MILLIMETERS
MIN MAX
–
5.08
0.36 0.58
0.97 1.65
0.20 0.38
5.59 7.87
7.37 8.13
2.54
3.18 5.08
3.81
–
0.38 1.78
–
2.49
0.13
–
S
CERDIP
CERAMIC DUAL-IN-LINE
PACKAGE
(0.300 in.)
DIM PINS
D8
D 14
D 16
D 18
D 20
D 24
INCHES
MIN MAX
– 0.405
– 0.785
– 0.840
– 0.960
– 1.060
– 1.280
MILLIMETERS
MIN MAX
– 10.29
– 19.94
– 21.34
– 24.38
– 26.92
– 32.51
PACKAGE OUTLINE, TSSOP 4.40mm BODY
21-0066
G
1
1
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
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