AP7365
Electrical Characteristics (continued) (@TA = +25°C, VIN = VOUT +1V, COUT = 1μF, CIN = 1μF, VEN = 2V, unless otherwise
specified.)
Symbol
Parameter
JA Thermal Resistance Junction-to-Ambient
JC Thermal Resistance Junction-to-Case
Test Conditions
SOT25 (Note 7)
U-DFN2020-6 (Note 7)
SOT89 (Note 7)
SOT223 (Note 7)
SOT25 (Note 7)
U-DFN2020-6 (Note 7)
SOT89 (Note 7)
SOT223 (Note 7)
Min
Typ
Max
Unit
—
169
—
—
132
—
°C/W
—
133
—
—
142
—
—
31
—
—
48
—
°C/W
—
30
—
—
39
—
Note:
7. Test condition for all packages: Device mounted on FR-4 substrate PC board, 1oz copper, with minimum recommended pad layout.
Typical Performance Characteristics
VEN = 0 to 2V (1V/div)
VIN = 5V
CIN = COUT = 1μF
VEN = 0 to 2V (1V/div)
VIN = 5V
CIN = COUT = 1μF
VOUT = 3.3V (1V/div)
with no load
Time (40μs/div)
Start-Up Time
VOUT = 3.3V (1V/div)
with 600mA load
Time (40μs/div)
Start-Up Time
VIN = 4.3V to 5.3V (1V/div)
tR = tF = 2μs
CIN = none, COUT = 1μF
VOUT = 3.3V (20mV/div)
IOUT = 60mA (200mA/div)
Time (40μs/div)
Line Transient Response
AP7365
Document number: DS32260 Rev. 11 - 3
VIN = 4.3V to 5.3V (1V/div)
tR = tF = 2μs
CIN = none, COUT = 1μF
VOUT = 3.3V (20mV/div)
IOUT = 300mA (200mA/div)
Time (40μs/div)
Line Transient Response
4 of 18
www.diodes.com
March 2020
© Diodes Incorporated