LTC2360HS6 データシートの表示（PDF） - Linear Technology

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LTC2360HS6

100ksps/250ksps/500ksps, 12-Bit Serial ADCs in TSOT-23

Linear Technology 

LTC2360/LTC2361/LTC2362

PACKAGE DESCRIPTION

0.62

0.95

MAX

REF

S6 Package

6-Lead Plastic TSOT-23

(Reference LTC DWG # 05-08-1636)

2.90 BSC

(NOTE 4)

1.22 REF

3.85 MAX 2.62 REF

1.4 MIN

2.80 BSC 1.50 – 1.75

(NOTE 4)

PIN ONE ID

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

0.20 BSC

DATUM ‘A’

0.95 BSC

0.80 – 0.90

1.00 MAX

0.30 – 0.50 REF

0.09 – 0.20

1.90 BSC

NOTE:

(NOTE 3)

1. DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

2. DRAWING NOT TO SCALE

5. MOLD FLASH SHALL NOT EXCEED 0.254mm

3. DIMENSIONS ARE INCLUSIVE OF PLATING 6. JEDEC PACKAGE REFERENCE IS MO-193

TS8 Package

8-Lead Plastic TSOT-23

(Reference LTC DWG # 05-08-1637)

0.52

0.65

MAX

REF

2.90 BSC

(NOTE 4)

1.22 REF

3.85 MAX 2.62 REF

1.4 MIN

2.80 BSC

1.50 – 1.75

(NOTE 4)

PIN ONE ID

0.30 – 0.45

6 PLCS (NOTE 3)

0.01 – 0.10

S6 TSOT-23 0302 REV B

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

0.20 BSC

DATUM ‘A’

0.65 BSC

0.80 – 0.90

1.00 MAX

0.30 – 0.50 REF

NOTE:

1. DIMENSIONS ARE IN MILLIMETERS

2. DRAWING NOT TO SCALE

3. DIMENSIONS ARE INCLUSIVE OF PLATING

0.09 – 0.20

(NOTE 3)

1.95 BSC

4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

5. MOLD FLASH SHALL NOT EXCEED 0.254mm

6. JEDEC PACKAGE REFERENCE IS MO-193

0.22 – 0.36

8 PLCS (NOTE 3)

0.01 – 0.10

TS8 TSOT-23 0802

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

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