LTC2360/LTC2361/LTC2362
PACKAGE DESCRIPTION
0.62
0.95
MAX
REF
S6 Package
6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636)
2.90 BSC
(NOTE 4)
1.22 REF
3.85 MAX 2.62 REF
1.4 MIN
2.80 BSC 1.50 – 1.75
(NOTE 4)
PIN ONE ID
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
DATUM ‘A’
0.95 BSC
0.80 – 0.90
1.00 MAX
0.30 – 0.50 REF
0.09 – 0.20
1.90 BSC
NOTE:
(NOTE 3)
1. DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
2. DRAWING NOT TO SCALE
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
3. DIMENSIONS ARE INCLUSIVE OF PLATING 6. JEDEC PACKAGE REFERENCE IS MO-193
TS8 Package
8-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1637)
0.52
0.65
MAX
REF
2.90 BSC
(NOTE 4)
1.22 REF
3.85 MAX 2.62 REF
1.4 MIN
2.80 BSC
1.50 – 1.75
(NOTE 4)
PIN ONE ID
0.30 – 0.45
6 PLCS (NOTE 3)
0.01 – 0.10
S6 TSOT-23 0302 REV B
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
DATUM ‘A’
0.65 BSC
0.80 – 0.90
1.00 MAX
0.30 – 0.50 REF
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
0.09 – 0.20
(NOTE 3)
1.95 BSC
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
0.22 – 0.36
8 PLCS (NOTE 3)
0.01 – 0.10
TS8 TSOT-23 0802
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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