MUR240 データシートの表示（PDF） - Yea Shin Technology Co., Ltd
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MUR240 Datasheet PDF : 3 Pages
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DATA SHEET
SEMICONDUCTOR
MUR240
Power Rectifier
These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
Features
•Ultrafast Recovery Times
•175°C Operating Junction Temperature
•Low Forward Voltage
•Low Leakage Current
•High Temperature Glass Passivated Junction
•These are Pb−Free Devices*
•High temperature soldering : 260OC / 10 seconds at terminals
• Pb free product at available : 99% Sn above meet RoHS environment
substance directive request
DO-15
Unit:inch(mm)
.140 (3.6)
.104 (2.6)
DIA.
1.0 (25.4)
MIN.
Mechanical Characteristics:
•Case: Epoxy, Molded
•Weight: 0.4 Gram (Approximately)
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•Polarity: Cathode Indicated by Polarity Band
•Shipped in Plastic Bags; 1,000 per Bag
•Available Tape and Reel; 5,000 per Reel, by Adding a “RL’’ Suffix to
the Part Number
.034 (.86)
.028 (.71)
DIA.
.300 (7.6)
.230 (5.8)
1.0 (25.4)
MIN.
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Symbol
VRRM
VRWM
VR
Value
400
—
Unit
V
Average Rectified Forward Current (Note 1)
2.0 @
IF(AV)
A
(Square Wave Mounting Method #3 Per Note 3)
TA = 85°C
Non-Repetitive Peak Surge Current
(Surge applied at rated load conditions,
halfwave, single phase, 60 Hz)
IFSM
60
A
Operating Junction Temperature and Storage
–55 to
TJ, Tstg
°C
Temperature Range
+150
THERMAL CHARACTERISTICS
Characteristic
Symbol Value
Unit
Maximum Thermal Resistance,
Junction−to−Ambient
RөJA
See
Note 3
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Pulse Test: Pulse Width = 300μs, Duty Cycle ≤ 2.0%.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
http://www.yeashin.com
1
REV.02 20110725
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