MBF110PFW1STG データシートの表示（PDF） - Fujitsu

部品番号

コンポーネント説明

メーカー

MBF110PFW1STG

Solid-State Fingerprint Sensor

Fujitsu 

MBF110

Manufacturing Considerations

CAUTION: DO NOT USE ANY METAL PICKUP TOOLS WHICH WOULD CONTACT THE SENSOR DEVICE SURFACE WITHOUT

PROTECTIVE LID INSTALLED

• Surface Mount reflow temperature:

Recommended 220°C Max reflow spike*

Max Temp

240°C

• Avoid any high pressure spray directly to the sensor device surface.

• Use standard handling practices for ESD sensitive devices.

• Refer to Fujitsu PCB Assembly for Biometric Sensor Guidelines.

Array Pixel Specifications:

Notes:

Specification

Max Failed Pixels

y Max Failed Rows

r Max Failed Columns

MBF110-LP

10

0

0

MBF110-STD

300

1 (see note 1)

1 (see note 1)

a 1) Failing rows or columns that fall on rows (0-4) or (295-299) or columns (0-4) or (295-299) are allowed to pass for the STD product due to packaging overlap at the edge of the

in sensor array. Failed rows or columns at the extreme edge of the array do not affect the quality of the acquired fingerprint image.

Prelim

Fujitsu Microelectronics, Inc. 17

Share Link: