MAX696/MAX697
Microprocessor Supervisory Circuits
Chip Topography
MAX697
TEST
RESET RESET
VCC
0.116”
[2.95mm]
LLIN
GND
WDO
CE IN
CE OUT
MAX696
VOUT VBATT
RESET RESET
VCC
0.116”
[2.95mm]
GND
BATT ON
WDO
LLIN
WDI
LOW LINE
OSC IN OSC PFI PFO
SEL
0.084”
[2.13mm]
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
16 CERDIP
16 PDIP
16 Wide SO
PACKAGE
CODE
J16-3
P16+1
W16+1
OUTLINE
NO.
21-0045
21-0043
21-0042
LAND
PATTERN NO.
—
—
90-0107
WDI
LOW LINE
OSC IN OSC PFI PFO
SEL
0.084”
[2.13mm]
www.maximintegrated.com
Maxim Integrated │ 15