FMA501 データシートの表示（PDF） - Filtronic PLC
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FMA501 Datasheet PDF : 4 Pages
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Preliminary Data Sheet
FMA501
OC-192 MODULATOR DRIVER AMPLIFIER
• ASSEMBLY DIAGRAM
GND
Chip capacitor: 100nF
VDD=7~8V
Inductor for
drain = 300uH
Gate bias: VGG = -3.0 V Gain control: VGC = 1.5 V
Notes:
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Apply VGG first, then VGC and VDD.
Disconnect VGC first, then VDD and VGG when turning off.
Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The
bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is
recommended. Ultrasonic bonding is not recommended.
The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150°C for 45 minutes.
Bond on bond or stitch bonds acceptable.
Conductor over conductor acceptable. Conductors must not short.
Phone: (408) 988-1845
Fax: (408) 970-9950
http:// www.filss.com
Revised: 3/22/02
Email: sales@filss.com
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