NDT2955 データシートの表示（PDF） - Fairchild Semiconductor
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NDT2955 Datasheet PDF : 5 Pages
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Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Avalanche Ratings
WDSS
Drain-Source Avalanche Energy
Single Pulse, VDD = 30 V, ID = 2.5 A
174 mJ
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage
∆BVDSS
∆TJ
IDSS
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
IGSSF
Gate–Body Leakage, Forward
IGSSR
Gate–Body Leakage, Reverse
VGS = 0 V,
ID = –250 µA
ID = –250 µA, Referenced to 25°C
VDS = –60 V,
VGS = –20 V,
VGS = –20 V,
VGS = 0 V
VDS = 0 V
VDS = 0 V
–60
–60
V
mV/°C
–10 µA
100 nA
–100 nA
On Characteristics (Note 2)
VGS(th)
Gate Threshold Voltage
∆VGS(th)
∆TJ
RDS(on)
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
ID(on)
On–State Drain Current
gFS
Forward Transconductance
VDS = VGS,
ID = –250 µA
ID = –250 µA, Referenced to 25°C
VGS = –10 V, ID = –2.5 A
VGS = –4.5 V, ID = –2 A
VGS=–10 V, ID =–2.5 A, TJ=125°C
VGS = –10 V, VDS = –5 V
VDS = –10 V, ID = –2.5 A
–2 –2.6 –4
V
5.7
mV/°C
95 300 mΩ
163 500
153 513
–12
A
5.5
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
VDS = –30 V, V GS = 0 V,
f = 1.0 MHz
Crss
Reverse Transfer Capacitance
601
pF
85
pF
35
pF
Switching Characteristics
td(on)
Turn–On Delay Time
tr
Turn–On Rise Time
td(off)
Turn–Off Delay Time
tf
Turn–Off Fall Time
Qg
Total Gate Charge
Qgs
Gate–Source Charge
Qgd
Gate–Drain Charge
(Note 2)
VDD = –30 V, ID = –1 A,
VGS = –10 V, RGEN = 6 Ω
VDS = –30 V, ID = –2.5 A,
VGS = –10 V
12 21
ns
10 20
ns
19 34
ns
6
12
ns
11 15
nC
2.4
nC
2.7
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V, IS = –2.5 A (Note 2)
trr
Diode Reverse Recovery Time
IF = –2.5 A,
Qrr
Diode Reverse Recovery Charge diF/dt = 100 A/µs
–2.5 A
–0.8 –1.2 V
25
nS
40
nC
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 42°C/W when
mounted on a 1in2
pad of 2 oz copper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
b) 95°C/W when
mounted on a .0066
in2 pad of 2 oz
copper
c) 110°C/W when mounted on a
minimum pad.
NDT2955 Rev.1.4
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