BZT52C10S データシートの表示（PDF） - Micro Commercial Components

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BZT52C10S

200 mW Zener Diode 2.4 to 56 Volts

Micro Commercial Components 

MCC

R

Micro Commercial Components

 omponents

20736 Marilla Street Chatsworth



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BZT52C2V4S

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BZT52C56S

Features

x Planar Die Construction

x 200mW Power Dissipation on Ceramic PCB

x General Purpose Medium Current

x Ideally Suited for Automated Assembly Processes

• Epoxy meets UL 94 V-0 flammability rating

• Moisture Sensitivity Level 1

• Lead Free Finish/RoHS Compliant("P" Suffix

designates RoHS Compliant. See ordering information)

• Halogen free available upon request by adding suffix "-HF"

Absolute Maximum Ratings

Symbol

PD

TJ

TSTG

Parameter

Power dissipation

Junction Temperature

Storage Temperature Range

Rating

Unit

200

mW

C

-65 to +150

к

-65 to +150

к

H

200 mW

Zener Diode

2.4 to 56 Volts

SOD-323

A

B

E

D

Absolute Maximum Ratings

Symbol

Parameter

Rating

Unit

RthJA

Thermal Resistance Junction to

Ambient*

625

к/W

* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with

pad areas 25 mm2

Electrical Characteristics

Symbol

Parameter

Rating

Unit

VF

Maximum Forward Voltage

(IF=10mAdc)

0.9

V

G

J

DIMENSIONS

DIM

INCHES

MM

NOTE

MIN MAX MIN MAX

A .090 .107 2.30 2.70

B .063 .071 1.60 1.80

C .045 .053 1.15 1.35

D .031 .045 0.80 1.15

E .010 .016 0.25 0.40

G .004 .018 0.10 0.45

H .004 .010 0.10 0.25

J ----- .006 ----- 0.15

SUGGESTED SOLDER

PAD LAYOUT

0.074"

0.027”

0.022”

Revision: D

www.mccsemi.com

1 of 4

2018/02/11

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