CXG1030N データシートの表示（PDF） - Sony Semiconductor

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CXG1030N

Power Amplifier for PHS

Sony Semiconductor 

Package Outline Unit : mm

16PIN SSOP (PLASTIC)

∗5.0 ± 0.1

16

9

A

+ 0.2

1.25 – 0.1

0.1

1

+ 0.1

0.22 – 0.05

8

0.65 ± 0.12

+ 0.05

0.15 – 0.02

0.1 ± 0.1

CXG1030N

0° to 10°

DETAIL A

NOTE: Dimension “∗” does not include mold protrusion.

: PALLADIUM PLATING

This product uses PdPPF

(Palladium Pre-Plated Lead Frame).

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

SONY CODE

SSOP-16P-L01

LEAD TREATMENT

SOLDER / PALLADIUM

PLATING

EIAJ CODE

SSOP016-P-0044

LEAD MATERIAL

COPPER / 42 ALLOY

JEDEC CODE

PACKAGE WEIGHT

0.1g

—5—

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