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LX1563IDM(2005) データシートの表示(PDF) - Microsemi Corporation

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LX1563IDM
(Rev.:2005)
Microsemi
Microsemi Corporation Microsemi
LX1563IDM Datasheet PDF : 25 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
LX1562/1563
PRODUCT DATABOOK 1996/1997
SECOND-GENERATION POWER FACTOR CONTROLLER
PRODUCTION DATA SHEET
A B S O L U T E M A X I M U M R AT I N G S (Note 1)
Supply Voltage (V ) ...................................................................................... -0.3V to 28V
IN
Peak Driver Output Current (Note 3) ................................................................. ±500mA
Driver Output Clamping Diodes
V > V or V < -0.3V ........................................................................................ ±10mA
O
CC
O
Detector Clamping Diodes
VDET > 6V or VDET < 0.9V ..................................................................................... ±10mA
Error Amp, Multiplier, and Comparator Input Voltages ................................ -0.3V to 6V
Detector Input Voltage (Note 2) ....................................................................... -0.3 to 6V
Operating Junction Temperature
Plastic (M and DM Packages) ............................................................................... 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 Seconds) ............................................................ 300°C
Pb-free / RoHS Peak Package Solder Reflow Temp (40 second max. exposure)...............260°C (+0, -5)
Note 1. Values beyond which damage may occur. All voltages are specified with respect to
ground, and all currents are positive into the specified terminal.
Note 2. With no limiting resistor.
Note 3. Current duty cycle is chosen such that TJ is below 150°C.
T H E R M A L D ATA
M PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
DM PACKAGE:
95°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
165°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θJA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow
PACKAGE PIN OUTS
E.A. INV. 1
E.A. OUT 2
MULT. INPUT 3
C.S. 4
8
VIN
7 OUT
6 GROUND
5
IDET
M PACKAGE
(Top View)
E.A. INV.
E.A. OUT
MULT. INPUT
C.S.
1
8
VIN
2
7
OUT
3
6
GROUND
4
5
IDET
DM PACKAGE
(Top View)
RoHS / Pb-free 100% Matte Tin Lead Finish
2
Copyright © 1996
Rev. 1.3a 8/30

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