CD4017BMS データシートの表示（PDF） - Intersil
部品番号
コンポーネント説明
メーカー
CD4017BMS Datasheet PDF : 10 Pages
| |||
CD4017BMS, CD4022BMS
Chip Dimensions and Pad Layouts
CD4017BMSH
Dimensions in parentheses are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10-3 inch)
CD4022BMSH
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218
10
Share Link: 