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5962R9672302QCC データシートの表示(PDF) - Intersil

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5962R9672302QCC Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
HS-245RH, HS-246RH, HS-248RH
Die Characteristics
DIE DIMENSIONS:
45 mils x 47 mils x 11 mils
1140µm x 1190µm x 280µm
INTERFACE MATERIALS:
Glassivation:
Type: Silox
Thickness: 8kÅ ±1kÅ
Top Metallization:
Type: T.W.
Thickness: 2.5kÅ ±0.5kÅ
Type: Al
Thickness: 14kÅ ±2kÅ
Substrate:
ALPS Bipolar/Dielectric Isolation
Backside Finish:
Silicon
Metallization Mask Layout
HS-246RH
ASSEMBLY RELATED INFORMATION:
Substrate Potential:
Unbiased
ADDITIONAL INFORMATION:
Worst Case Current Density:
1.4 x 105 A/cm2
Transistor Count:
9
HS-248RH
OUTPUT R1 3
(-) INPUT
(+) INPUT
VEE R1 AND R2
VEE R3
OUTPUT R3
OUTPUT R1
(-) INPUT
(+) INPUT
VEE R1 AND R2
VEE R3
OUTPUT R3
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
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