TZA3034T データシートの表示（PDF） - Philips Electronics
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TZA3034T Datasheet PDF : 28 Pages
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Philips Semiconductors
SDH/SONET STM1/OC3 postamplifier
Product specification
TZA3034
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134.
SYMBOL
VCC
Vn
In
Ptot
Tstg
Tj
Tamb
PARAMETER
supply voltage
DC voltage
pins DIN, DINQ, CF, JAM and RSET
pins STQ, ST, DOUTQ and DOUT
pin Vref
DC current
pins DIN, DINQ, CF and JAM
pins STQ, ST, DOUTQ and DOUT
pin Vref
pin RSET
total power dissipation
storage temperature
junction temperature
ambient temperature
MIN.
−0.5
MAX.
+6
UNIT
V
−0.5
VCC − 2
−0.5
VCC + 0.5 V
VCC + 0.5 V
+3.2
V
−1
+1
mA
−25
+10
mA
−2
+2.5
mA
−2
+2
mA
−
300
mW
−65
+150
°C
−
150
°C
−40
+85
°C
HANDLING
This device is ESD sensitive and should be handled with care. Precautions should be taken to avoid damage through
electrostatic discharge. This is particularly important during assembly and handling of the bare die. Additional safety can
be obtained by bonding the VCC and GND pads first, the remaining pads may then be bonded to their external
connections in any order.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
CONDITION
thermal resistance from junction to ambient note 1
SO16 package
TSSOP16 package
VALUE
115
150
UNIT
K/W
K/W
Note
1. Thermal resistance from junction to ambient is determined with the IC soldered on a standard single-sided
57 × 57 × 1.6 mm FR4 epoxy printed-circuit board with 35 µm thick copper traces. The measurements are performed
in still air.
1999 Nov 03
10
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