LG1628BXA データシートの表示（PDF） - Agere -> LSI Corporation
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LG1628BXA Datasheet PDF : 12 Pages
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LG1628AXA SONET/SDH 2.488 Gbits/s
Transimpedance Amplifier
Die Pad Configuration
The die pad configuration is shown in Figure 2.
Preliminary Data Sheet
January 1998
DNC
GND1
IN–
IN+
GND1
BYPASS
22 21 20 19 19 19 19 18 18 17
16
23
15
24
15
24
OUTSIDE DIE DIMENSIONS:
1.62 mm2 x 1.62 mm2
PAD SIZE:
14
100 µm2 x 100 µm2
(EXCEPT PAD #23, 100 µm2 x 150 µm2)
PAD SEPARATION:
14
50 µm
1
13
2
12
3
12
34
5678
9 10 11 11
BG
GND2
OUT+
OUT–
GND2
VSS2
Figure 2. Die Pad Configuration
5-5336(F)r.2
2
Lucent Technologies Inc.
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