V14MLN41206(2010) データシートの表示（PDF） - Littelfuse, Inc
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V14MLN41206 Datasheet PDF : 6 Pages
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Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MLN Series
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
The recommended solder for the MLN suppressor is
a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb).
Littelfuse also recommends an RMA solder flux.
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the MLN chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50ºC before cleaning.
Reflow Solder Profile
250
MAXIMUM TEMPERATURE
230°C
200
40-80
SECONDS
ABOVE 183°C
150
RAMP RATE
<2°C/s
100
PREHEAT DWELL
50
PREHEAT ZONE
0
0
Figure 10
0.5 1.0
1.5 2.0 2.5 3.0 3.5 4.0
TIME (MINUTES)
Wave Solder Profile
300
MAXIMUM WAVE 260°C
250
200
150
SECOND PREHEAT
100
FIRST PREHEAT
50
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Figure 11
TIME (MINUTES)
MLN SurgeArray™ Suppressor
Revision: August 10, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MLN.html for current information.
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