SG3546 データシートの表示（PDF） - Microsemi Corporation
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SG3546 Datasheet PDF : 7 Pages
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SG3546
PRODUCT DATABOOK 1996/1997
3.3V UN D E RV O LTAGE SENSING C I R C U I T
PRODUCTION DATA SHEET
A B S O L U T E M A X I M U M R AT I N G S (Note 1)
Input Supply Voltage (V )............................................................................... -1V to 12V
IN
RESET Output Voltage (VOUT) .......................................................................... -1V to 12V
Clamp Diode Forward Current .............................................................................. 100mA
Operating Junction Temperature
Plastic (DM - Package) ......................................................................................... 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ............................................................ 300°C
Peak Package Solder Reflow Temp. (40 second max. exposure).......................................260C (+0, -5)
Note 1. Values beyond which damage may occur. All voltages are specified with respect to
ground, and all currents are positive into the specified terminal.
T H E R M A L D ATA
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
LP PACKAGE:
165°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
156°C/W
Junction Temperature Calculation: T = T + (P x θ ).
J
A
D
JA
The θJA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow.
PACKAGE PIN OUTS
RESET
INPUT
N.C.
GROUND
18
27
36
45
N.C.
N.C.
N.C.
N.C.
DM PACKAGE
(Top View)
3. GROUND
2. INPUT
1. RESET
LP PACKAGE
(Top View)
RoHS / Pb-free 100% Matte Tin Lead Finish
INPUT
2
BLOCK DIAGRAM
RESET
1
1.2 VREF
4
GROUND
2
Copyright © 1994
Rev. 1.3a 10/14
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