CXB1455R データシートの表示（PDF） - Sony Semiconductor
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CXB1455R Datasheet PDF : 15 Pages
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Recommended Printed Board Structure
,,,, Recommended Printed Circuit Board Pattern
L1: Cu plate (18µm) + solder coat
I1: Fiber-glass epoxy core (0.3mm)
L2: Cu plate (36µm)
I2: Fiber-glass epoxy core (0.8mm)
L3: Cu plate (36µm)
I3: Fiber-glass epoxy core (0.3mm)
L4: Cu plate (18µm) + solder coat
Example of power supply and special signal routing
0.5mm
A : Through hole to the GNDA plane (L2)
G : Through hole to the GND plane (L2)
L2 doesn't have the plane
in this area.
E : Through hole to the VccA plane (L3)
T : Through hole to the Vcc plane (L3)
E
E
R : Through hole to the REXT resistor (L4)
P : Through hole to the CKPOL signal (L4)
C : Through hole to the CE signal (L4)
Chip capacitor
A
Chip resistor
E
G
CXB1455R
G
37
37
GND
REFREQ
CNTL
DE
SFTCLK
HSYNC
VSYNC
BLU <7>
BLU <6>
BLU <5>
BLU <4>
48
48
VCC
RG
P
C
T
T
T
VCC
RED <0>
RED <1>
RED <2>
RED <3>
RED <4>
RED <5>
RED <6>
RED <7>
GRN <0>
GRN <1>
GND
G
24
13 Locate the bypass capacitor
(0.1µF chip capacitor) as close
to the pins as possible.
G
1
12
Microstrip Line
The microstrip line with the characteristic impedance of 50Ω should be used to connect the LSI transmission
signal pin SDATAP/N to the connector foot printer as GVIF transmits the high-speed digital signal with the
maximum speed of 2Gb/s. The optimal line can be made by forming 0.5mm pattern on L1. (See the board
structure shown below.) The line lengths should be the same and the through hole should be not used.
Normally, L2 should be the mat GND.
Termination Elements
Locate the 51Ω termination resistors as close to the LSI as possible.
Filter Device and Reference Resistor
The capacitor and resistor connected to LPFA/B and REXT are the filter and the reference resistor. Locate
them as close to the LSI as possible. Decrease the parasitic capacitance by removing the L2 GND plane
under these elements and wiring.
– 11 –
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