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LX1431 データシートの表示(PDF) - Microsemi Corporation

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LX1431
Microsemi
Microsemi Corporation Microsemi
LX1431 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
LX1431
PRODUCT DATABOOK 1996/1997
PROGRAMMABLE REFERENCE
PRODUCTION DATA SHEET
A B S O L U T E M A X I M U M R AT I N G S (Note 1)
V+, V
................................................................................................................. 36V
COLLECTOR
VCOMP, RTOP, RMID, VREF ...................................................................................................... 6V
GND-F to GND-S ........................................................................................................ 0.7V
Operating Junction Temperature
Plastic (M, DM Packages) ..................................................................................... 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature ..................................................................................................... 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
to Ground. Currents are positive into, negative out of the specified terminal.
T H E R MAL DATA
M PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
DM PACKAGE:
95°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
165°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θ numbers are guidelines for the thermal performance of the device/pc-board system.
JA
All of the above assume no ambient airflow.
RTOP
4
5K
REF 8
RMID 7
5K
BLOCK DIAGRAM
V+
COMP
3
2
gm=
60µA/V
2.5V
COLLECTOR
1
PACKAGE PIN OUTS
COLLECTOR 1
COMP 2
V+ 3
RTOP
4
8 REF
7
RMID
6 GND-F
5 GND-S
M PACKAGE
(Top View)
COLLECTOR
COMP
V+
RTOP
1
8
REF
2
7
RMID
3
6
GND-F
4
5
GND-S
DM PACKAGE
(Top View)
5
GND-SENSE
6
GND-FORCE
2
Copyright © 1997
Rev. 1.2 4/97

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