BZX55C15(2010) データシートの表示（PDF） - Formosa Technology

部品番号

コンポーネント説明

メーカー

BZX55C15
(Rev.:2010)

Zener Diode

Formosa Technology 

Zener Diode

Formosa MS

BZX55C2V4 THRU BZX55C100

High reliability test capabilities

Item Test

1. Solder Resistance

Conditions

at 260±5oC for 10±2sec.

immerse body into solder 1/16"±1/32"

2. Solderability

at 245±5oC for 5 sec.

3. Pull Test

0.25kg in axial lead direction for 10 sec.

4. Bend Lead

5. High Temperature Reverse Bias

0.25kg weight applied to each lead bending

arc 90o±5o for 3 times.

VR=80% rate at TJ=150oC for 168 hrs.

Reference

MIL-STD-750D

METHOD-2031

MIL-STD-202F

METHOD-208

MIL-STD-750D

METHOD-2036

MIL-STD-750D

METHOD-2036

MIL-STD-750D

METHOD-1038

6. Pressure Cooker

7. Temperature Cycling

8. Thermal Shock

15PSIG at TA=121oC for 4 hrs.

-55oC to +125oC dwelled for 30 min.

and transferred for 5min. total 10 cycles.

0oC for 5 min. rise to 100oC for 5 min. total 10 cycles.

9. Humidity

at TA=85oC, RH=85% for 1000hrs.

10. High Temperature Storage Life

at 175oC for 1000 hrs.

JESD22-A102

MIL-STD-750D

METHOD-1051

MIL-STD-750D

METHOD-1056

MIL-STD-750D

METHOD-1021

MIL-STD-750D

METHOD-1031

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Page 8

Document ID Issued Date

DS-222713 2008/02/10

Revised Date Revision

2010/03/10

B

Page.

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